n i chia st s-da1- 2599c nichia corporation specifications for white led NSSW204CT pb-f r e e r e f l o w so lder ing a ppli c at io n r o hs co mp lia nt http://
n i chia st s-da1- 2599c 1 specifica t ions (1) ab sol u te maxi mum r a ti ngs item symbol absolute maximum rating unit forward current i f 25 ma pulse forward current i fp 80 ma reverse voltage v r 5 v power dissipation p d 82.5 mw operating temperature t opr -30~85 c storage temperature t stg -40~100 c junction temperature t j 105 c * abs o l u te maxi mum r a t i ngs at t a =25c. * i fp co ndit io n s wi th pu ls e wi dth 1 0 m s an d dut y cycl e 10%. ( 2 ) in it ial e l ect r ical/ o pt i cal c h ar acterist ics ite m symbol condition typ max unit forward voltage v f i f =20ma 3.0 - v reverse current i r v r =5v - - a luminous flux (chro m at ic it y coordinat e 1) v i f =20ma 7.6 - lm lum i no us in te nsit y (chro m at ic it y coordinat e 1) i v i f =20ma 2.4 - cd x - i f =20ma 0.300 - - chroma ticit y c oordinate1 y - i f =20ma 0.295 - - lum i no us f l ux (chro m at ic it y coordinat e 2) v i f =20ma 7.3 - lm lum i no us in te nsit y (chro m at ic it y coordinat e 2) i v i f =20ma 2.3 - cd x - i f =20ma 0.290 - - chroma ticit y c oordinate2 y - i f =20ma 0.275 - - thermal resistance r js - 120 180 c/w * char acteristics at t a =25c . * lum i nous f l ux v a l u e as p e r cie 127: 200 7 s t andard . * chrom a t i ci t y coordi nate s as pe r cie 1931 chrom a ti cit y chart . * r js is th ermal r e si sta n ce from juncti o n to t s measur in g point.
n i chia st s-da1- 2599c 2 ranks item rank min max unit forward voltage - 2.7 3.3 v reverse current - - 50 a nw775 7.75 8.00 nw750 7.50 7.75 nw725 7.25 7.50 nw700 7.00 7.25 nw675 6.75 7.00 luminous flux n w 650 6. 50 6. 75 lm color r a nks r a nk sa52 rank sa56 x 0. 2800 0. 2720 0. 2820 0. 2880 x 0. 2830 0. 2800 0. 2880 0.2910 y 0. 2480 0. 2580 0. 2720 0. 2620 y 0. 2440 0. 2480 0. 2620 0.2580 r a nk sa57 rank sa62 x 0. 2720 0. 2793 0. 2820 x 0. 2880 0. 2820 0.2910 0.2960 y 0. 2580 0. 2755 0. 2720 y 0. 2620 0. 2720 0.2870 0.2760 r a nk sa66 rank sa67 x 0. 2910 0. 2880 0. 2960 0. 2980 x 0. 2820 0. 2793 0. 2887 0.2910 y 0. 2580 0. 2620 0. 2760 0. 2710 y 0. 2720 0. 2755 0. 2916 0.2870 ra n k s b j 2 rank sbj6 x 0. 2960 0. 2910 0. 2990 0. 3040 x 0. 2980 0. 2960 0. 3040 0.3062 y 0. 2760 0. 2870 0. 3010 0. 2900 y 0. 2710 0. 2760 0. 2900 0.2853 rank sbj7 x 0. 2910 0. 2887 0. 2968 0. 2990 y 0. 2870 0. 2916 0. 3058 0. 3010 * r a nking at t a =25c. * f o rw ard v o l t age t o le r a nce: 0. 05v * luminous flux t o ler a nc e: 7% * chrom a t i ci t y coordi nate t ol e r a nce : 0 . 005 * led s from the abo v e r a nk s wil l b e shi p p e d. the r a nk combinat ion r a t i o per sh ipmen t will be d e cided by nichia . lum i no us f l ux r a nks by color r a nk ranking by luminous flux r a nking by color coordinates n w 650 nw675 nw700 nw725 nw750 nw775 sa52,sa56, sa57 sa62,sa66, sa67 sbj2,sbj6,sbj7
n i chia st s-da1- 2599c 3 chroma ticity d i agram sa52 sa56 sa 5 7 sa 6 2 sa 6 6 sa 6 7 sb j 2 sb j 6 sb j 7 0.20 0.25 0.30 0.35 0.40 0.20 0.25 0.3 0 0 .35 0.40 x y
n i chia st s-da1- 2599c 4 outline dimensions sts- da7- 3531a n ssw204c ? no. ( g unit: mm) t h is produc t co m p li es wi th ro hs d i re cti v e. u ? ro hs ? m ?? * ( g unit : mm, to le r a n c e : 0 . 1 ) ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ????` heat-resistant polymer ?`? ? + w? silicone resin (with diffuser and phosphor) ~? + y? ag-plated copper alloy 0.0028g( t y p ) dimensions do not include mold flash or metal burr. ? * ka 3.5 cathode mark (0.29) 0.4 0.08 3.8 (3.6) (2.2) cathode anode 0.65 (0.63) 0.3 0.67 0.27 (0.06) 1 0.43 0.34
n i chia st s-da1- 2599c 5 soldering ? r e co mm end e d r e f l ow sold ering co ndi t io n ( lead -free sol d er) ? r e co mm end e d hand so lde r ing cond it ion temperature 350c max soldering time 3sec max r e co mmen d e d sold ering p ad p a ttern ( g unit: mm) 1.5 2.1 1.5 0.85 (0.19) * thi s led is desi gned to be refl ow so l d ered on to a pc b . if dip soldered , n i ch ia can n ot guar antee its r e liabilit y . * r e flow so ld ering mu st not be performed more than twic e. han d sold ering mu st not b e performed more than o n ce. * a v oid r apid cooling. r a mp down th e temp er ature gr adua lly from th e peak temper ature. * n i trogen ref l ow soldering is re co mmend e d. air flow sold ering cond it ion s can cause op tical d e gr adation, caused by h e at and / or atmospher e . * r e pairing should not be d one after th e l e ds ha v e been solder ed. wh en repair i ng is u n a v oidable, a double-h ead solder ing ir on shou ld be u s ed. it should b e confir med b e forehand wh et h e r th e char ac te ri st i cs of th e l e d s wi ll or w i l l not be damaged by repairing . * when sold ering, do not ap ply stre s s to t h e le d whi l e th e le d is hot . 120sec max pre- hea t 180 t o 200c 260c max 10sec max 60sec max above 220c 1 t o 5c per sec
n i chia st s-da1- 2599c 6 t a pe and reel dimensions n x xx204x sts- da7- 0172 quant i t y p e r r eel=6000pc s 1 ` ? 6000 * the t ape packing met h od compl i es wi t h j i s c 0806 (packagin g o f elect r o n ic co mp o n ents on c ontinuo u s t apes ) . * j i s c 0 806 ? ` ? ?`? tape 1.75 0 . 1 2 0 .0 5 4 0.1 5.5 0 . 0 5 4 0. 1 12 +0 .3 -0. 1 -0 1.5 +0 . 1 ( g uni t : mm) no. ` ? reel 15. 4 1 60 +1 -0 -0 180 +0 -3 2 1 0 . 8 1 3 0 . 2 ? la b e l 13 +1 ? ` / ` trailer and leader ?? ` ?` e m bossed carrier tape ? ??` to p co ver ta p e f eed di rect ion ` 400mm l e ader witho u t to p co ver ta pe 4 0 0 m m mi n ? ` 160mm trai le r 1 60mm mi n(empty po ckets ) led ? lo aded po ck ets 100 m m l e ader w i th t op co ver t ape 100 mm min(empty poc k et) 0.5 5 0 .1 0.2 0. 0 5 3. 91 0.1 1. 1 0 .1 0.8 0.0 5 catho d e mark
n i chia st s-da1- 2599c 7 p a ckaging - t a pe & reel nichia led sts-da7-0006c n x xxxxxx ? label la b e l no . reel ` ?` sea l moistu re-proo f ba g ? ? rohs nxxx xx xx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan typ e lot qty . ym xx xx -rrr pcs rohs nxx xxx xx xxxx led ** *** ** rr r pcs typ e rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-seale d moisture-proof bags. ` ? ` de sic c ant s ? mo is tu re -pr o of ba gs a r e pa ck e d in c a r d bo a r d bo x e s w i th c or r u ga ted pa rti t i on s . ? K ? ` ? ?` ? ? ? y ? ? * ? \ H? y ? B ? ? y * ? Q H n ? u? p ? ? ? ? * using the o r iginal package ma ter i al o r e q u i valen t in t r an s i t is r e c o mme n d e d . do no t expos e to water. t h e bo x i s no t water-res i s t ant. do no t drop or expos e t h e bo x to extern al fo rces a s it ma y damage the products. pr o d ucts sh ipp e d o n tape a n d r eel a r e p a ck ed in a moistu re-proo f bag. t h ey a r e shipp e d in card bo ard bo xes to p r otect th em fro m exte rnal f orce s during trans p o r ta tio n . * u ? ?` ? n ? g o ?` y ? if n ot provide d , it w ill n o t be in d i cat e d on t h e l a b e l . * ****** is t h e c u st omer part number . O * ******* ? for d e t a i l s, se e " l ot num b e r ing code " in t h is d o c u me n t . * ?? ? ? ?? t h e label does no t have the ran k f i eld fo r un-ranke d produc ts. * ? ? ?
n i chia st s-da1- 2599c 8 l o t numbering c o de lot numb er is presented by using th e following alpha n u m er ic cod e . ymxxxx - r r r y - y e a r year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - m o n t h month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx -n ichia's product n u m b er rrr - r ank i ng by color c oordinat e s , r a nking by lu mi nous fl ux
n i chia st s-da1- 2599c 9 dera ting characteristics n s s w 20 4c s t s -d a 7- 357 3a no . der a t i n g 1 0 10 20 30 40 50 0 2 04 06 08 0 1 0 0 1 2 0 ( 85 , 8. 50 ) ( 50 , 25.0) de r a t i n g 2 0 10 20 30 40 50 02 0 4 0 6 0 8 0 1 0 0 1 2 0 ( 68, 25. 0) ( 9 0 , 8. 50) du t y 1 10 10 0 1 1 0 100 25 80 S allowable forward current ( ma ) ` - S s o l d e r t e m p e r at u r e( c a t h o d e s i d e ) v s a l l o w a bl e f o r w a r d c u r r e n t ? ?- S a m b i en t t e m p e r a t u r e v s a l lo wa ble f o r w a r d c u r r e n t S al l o w a b l e f o r w a r d c u r r e n t ( m a) S a l l o w a b l e f o rw a rd c u rre n t ( m a ) ` ? ?? s o l d er t e m p er a t u r e( cath o d e s i d e ) ( c) ?? a m b i en t t e m p er a t u r e ( c ) ? ` ` du t y r a t i o ( %) ` ` - S d u ty r a ti o v s a llo wa ble f o r w a r d c u r r e n t t a =2 5 c 45 5c/w ja r =
n i chia st s-da1- 2599c 10 optical characteristics n s s w 20 4c n o . s t s -d a 7 -38 1 1 spectrum 0. 0 0. 2 0. 4 0. 6 0. 8 1. 0 350 4 0 0 4 5 0 500 55 0 6 00 650 70 0 7 5 0 r e l a t i v e i l l u m i na n c e ( a . u. ) di r e c t iv i t y 1 90 80 70 60 50 40 30 20 10 0 -1 0 -2 0 -3 0 -4 0 -5 0 -6 0 -7 0 -8 0 -9 0 y y xx k sp e c t r um k r e l a ti v e e m i s s i o n i n ten s i t y ( a. u . ) L wa v e l e n g th ( n m ) ? d ir e c t iv it y ? r a di a t i o n a n gl e x- x y-y 10.500.5 1 20 m a i f = t a =25c * ?? a l l ch a r act e r i st i c s sh ow n a r e f o r r e f e re n c e on l y a n d ar e n o t g u ara n t e e d . 20 m a i fp = t a =2 5 c
n i chia st s-da1- 2599c 11 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics n s s w 20 4c s t s -d a 7-38 12 no . tavf 2. 0 2. 5 3. 0 3. 5 4. 0 4. 5 - 60 - 40 - 2 0 0 2 0 4 0 60 80 10 0 120 ta i v 0. 6 0. 8 1. 0 1. 2 1. 4 - 60 - 40 - 2 0 0 2 0 4 0 60 80 1 00 12 0 vf i f 1 10 10 0 2. 0 2 . 5 3 . 0 3. 5 4. 0 4. 5 20 80 r e l a t i v e l um i n o us f l ux ( a . u. ) ? - am b i e n t te m p e r a t u r e v s r e l a t i v e l u m i no us f l u x fo r w a r d curren t( m a) ifiv 0.0 0.5 1.0 1. 5 2. 0 2. 5 3. 0 3. 5 4. 0 0 2 04 06 08 0 1 0 0 r e l a t i v e l um i no u s f l ux ( a . u. ) - fo r w a r d c u r r e n t v s r e la t i v e l u m i no us f l u x f o r w ard cu rre nt ( m a ) R- fo r w a r d v o l t a g e v s fo r w a r d c u r r e n t ? - R amb i e n t t e mp e r a t u r e v s fo r w a r d v o l t a g e ?R forward vo lt a g e( v ) R f o r w ar d v oltage(v) ?? ambient tem p erature ( c ) ?? a m b i en t t e m p erature(c) i fp = 20ma i fp = 60m a i fp = 5ma t a =25 c * ?? a l l c h ar ac t e r i s t i c s s h o w n a r e f o r r e f e r e n c e o n l y a n d a r e n o t g u ar a n t eed . t a =25c i fp = 20m a
n i chia st s-da1- 2599c 12 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics no . nssw 204c sts-da7-3813 ta x y 0.28 0. 29 0. 30 0. 31 0. 32 0. 2 8 0. 29 0. 30 0. 31 0. 32 -30c 0c 25 c 85 c x if x y 0.28 0. 29 0. 30 0. 31 0. 32 0. 28 0. 29 0. 30 0. 31 0. 32 1m a 5ma 20ma 25m a 80 m a x y y 20 m a i fp = ? - ? ambie nt te mperature vs chromaticity c oordinate - ? fo r w a r d c u r r e n t vs c h r o m a ti c i ty c o o r d i n a te t a =2 5 c * ? a l l c h a r ac t e r i st i c s sh ow n a r e f o r r e f e re n c e on l y a n d a r e n o t g u aran t e ed .
n i chia st s-da1- 2599c 13 reliability (1) t e s t s a n d r e sults te s t reference standard test conditions te s t duration failure criteria # units failed/tested r e si st anc e t o soldering heat (reflow soldering) j e it a ed- 4701 300 30 1 t sl d =260c, 10 s e c, 2refl ows , prec ondit i o n : 3 0 c, 70% r h , 168hr #1 0/ 50 solderability (reflow soldering) j e it a ed- 4701 303 30 3a t sl d =2455c, 5s ec, lead- fr ee sold er( s n- 3. 0ag - 0.5cu) #2 0/ 50 temperature cycle j e it a ed- 4701 100 10 5 - 40c( 30mi n )~25c( 5mi n )~ 100c( 30m i n )~25c( 5mi n ) 100c y c l e s #1 0/ 50 moisture resistance (cyclic) j e it a ed- 4701 200 20 3 25c~65c~-10c, 90% r h , 24hr per cy cle 10c y c l e s #1 0/ 50 high temperature stor age j e it a ed- 4701 200 20 1 t a =100c 1000hours #1 0/ 50 temperature humidity stor age j e it a ed- 4701 100 10 3 t a =60c, r h =90% 1000hours #1 0/ 50 low temperature stor age j e it a ed- 4701 200 20 2 t a =- 40c 1000hours #1 0/ 50 room temperature operating life condi t ion 1 t a =25c, i f =20m a t e st board : see n o tes b e low 1000hours #1 0/ 50 room temperature operating life condi t ion 2 t a =25c, i f =25m a t e st board : see n o tes b e low 500hours #1 0/ 50 high temperature oper ating lif e t a =85c, i f =8.5ma t e st board : see n o tes b e low 1000hours #1 0/ 50 temperature humidity oper ating lif e 60c, r h =90 % , i f =15m a t e st board : see n o tes b e low 500hours #1 0/ 50 low temperature oper ating lif e t a =- 30c, i f =20m a t e st board : see n o tes b e low 1000hours #1 0/ 50 vibr ation j e it a ed- 4701 400 40 3 200m / s 2 , 100 ~2000~100hz , 4 c ycle s, 4 m i n , each x, y , z 48m i n ut es #1 0/ 50 board bending j e it a ed - 4702b 003 1bend to a def l ection of 3mm for 51s ec #1 0/ 50 soldering joint shear streng th j e it a ed - 4702b 002 3 5n , 101s ec #1 0/ 50 no tes: 1) t e st board: fr4 board thic kness = 1.6m m, c o pper la y e r t h ic kness=35m , r ja 455c/ w 2) measu r ements are p e rformed af ter allo w i ng th e le ds to ret u rn to room te mper a t ure . ( 2 ) f a ilu re c r it eria crit eria # items conditions failure criteria forward voltage(v f ) i f =20ma >u.s.l.1.1 luminous flux( v ) i f =20ma u .s .l .2 . 0 #2 solderability - less than 95% solder coverage u . s.l . : up pe r specif ica t ion lim i t l.s.l. : lower spe c if ica t io n li mi t
n i chia st s-da1- 2599c 14 ca u t ion s (1) stor age conditions te m p e ra t u r e humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date stor age after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product c o m p li es wit h j e d e c msl 3 or equiv a lent . se e ipc/j e d e c std - 020 for m o i s t u re- s ens i t i v i t y det a il s. absorbed moisture in le d packages can v aporize and expand during soldering, w h ich can ca use in terface delamina tion and result in optical p e rforman c e degr ad ation . prod ucts are pack e d in moisture-proof alu m inu m bag s to min i mize moistur e abso r ptio n d u ring tr ansporta tion a n d stor age. in c l u d e d s ilic a ge l de si cc ant s ch an ge from bl u e t o re d i f m ois tu re h ad pe n e t r at e d bags. after openin g the moisture-proof alu m inu m bag, the pro d ucts should g o through th e solder ing pro c ess withi n th e r a nge of th e co ndi t ion s s t at ed above. un us e d rema in ing le ds shou ld be s t ored wi th silic a gel de sicca nt s in a hermetically sea l ed co nta i ner , prefer ably th e orig in al mo isture -pr oof bags for stor age. after t h e ?p eriod aft e r op enin g? s t or age time h a s be en exceed ed or s i l i ca ge l de sicca nts ar e no lo ng er blu e , the products should be b a k ed. baking should only be d one once. customer i s advi s ed to k e ep the leds in a n ai rti g ht co nt ainer w h e n not in u s e. expos u re to a corrosiv e en v i ronment may cause t h e pla t ed me ta l part s of the p r oduct to tarn i s h, w h i c h co ul d adverse ly affect so ld ering a n d optica l char acter i sti cs . it is also recommended to return th e le d s to th e orig inal moistur e p r oof bags and resea l . after assembly and dur i ng use, silv er p l at i n g can b e affe cted by t h e corrosive ga ses emitted by componen ts an d mater i als in close pro x imit y of the l e ds with in an end produ c t, a n d th e gas es e n ter i ng in to th e produc t from the exter n al a t mo spher e . the above should b e take n into cons ider a t ion w he n des i gning . r e sin mat e r i al s, in part i cu l a r , may co nta i n sub s ta nc e s whi c h ca n affe ct s i lver pla t i n g, su ch a s halo gen. do not use s u lfur- c on tai n i n g ma teri als i n commercial products. some mater i als, su ch a s seals and adh esives, ma y co nta i n su lfur . the extre m ely corroded or conta m inat ed plating of le ds mig h t cause a n open ci rc ui t. sil i co ne rubb er is re comme n d e d as a materi al for sea l s. bear in mi nd , t h e use of s i l i co ne s may l e ad to si li co ne con t a m i n at ion of e l e c tri c a l con t ac ts inside th e p r oduct s , caus e d by lo w mol e c u lar we igh t vol a tile siloxane . t o prevent w a ter cond en s a tion , p l eas e avoid large te m p er at ure a n d h u midi t y fl uc tua t ions for th e s t or age condi t io ns. (2) di recti o ns for use when de sig n ing a cir c u i t , t h e c u rren t thro ugh ea ch le d mu st no t exc e ed th e abso lu t e maxi mu m r a tin g . oper ating a t a co nstan t cu rrent p e r le d is reco mmen ded. in case of o p er ating at a consta nt v o ltag e, c i rcui t b is r e commended . if the led s are oper ated w i th con s ta nt vo ltag e us ing c i r c ui t a, th e curr ent throug h t h e le ds may v a ry due to t h e v a riat ion in f orw ard v oltage ch ar acteristics of the leds. (a) ... (b) .. . led s sho uld be o p er ated in f o r w ar d bias. dr iv ing c i r c ui ts mus t no t subj ect le ds to ei t h er forw ard or reverse vol t ag e whi l e off . continuo us reverse vol t ag e can caus e m i gr ation an d le d dam a ge. it is recom m en ded to ope r ate the le ds at a current gr eater t h an 10% of the sorting current to stabilize the le d char acter i stic s. care mu st b e taken to en s u re th at t h e re verse vol t age wil l no t exce ed the ab sol u t e maxi mu m r a t i ng when us ing the l e d s wi th matr ix drive . f o r outdoor use , ne ce ssary mea s ure s sho u ld be taken to prevent wa ter , moi s tur e and sal t air da mag e .
n i chia st s-da1- 2599c 15 (3) handl i n g precau ti ons do not hand le le ds wi th b a re hand s, it ma y con t a m i n ate t h e l e d su rface and affe c t opt i ca l char a c ter i s t i c s . in the worst case , ca tas t ro phic fa il ure fro m exce ss pr es sure throug h w i re-bond break s and packag e damage ma y r e su lt. when ha ndl i ng t h e produ c t wi th t w ee zer s , be carefu l n o t to apply exc e ss ive forc e to the r e s i n. otherwis e, the re si n can be cu t, ch ipped, delamina te or deform ed , causing w i re-bo n d breaks an d cata stroph ic fa ilures. dropping th e produc t ma y cause damage. do not sta c k asse mb led p c bs tog e t h er . f a il ure to comp l y can cau s e th e res i n port io n of the produ c t to be cut, ch ip ped, delaminated and/or defor m ed . it ma y cause w i re to break, l e ad ing to catas t roph ic f a il ures . (4) desi gn consi d er ati o n pcb warpag e after moun ti ng th e produc t s on to a pc b c a n cau s e the p a ckage to br ea k. the led s h ould be p l ac ed in a w a y to m i ni mize t h e s t re ss on the l e d s due to pc b bo w and twis t. the positi o n and ori e nta t i o n of the leds affect how much m e cha n i c al stre ss i s exerte d on the led s plac ed near th e score l i n e s . the led s h ould be p l ac ed in a w a y to mi ni mize t h e s t re ss on the l e d s due to board f l ex ing. board separ a tion mu st b e performed us in g spec ia l j i g s , no t u s in g hand s. (5) el ectrostati c di scha r ge (es d ) the produ c t s are se ns it ive to sta t ic e l e c tr i c i t y or surg e voltag e. es d ca n damag e a di e and i t s re l i ab il i t y . when handl i ng t h e produ c ts , th e fol l owi n g mea s ure s ag ains t e l e c tro s t a ti c di sch arge are stron g ly re com m e n ded : e l i m i n a t i n g t h e c h a r g e grounded wri s t str a p , esd footw e ar , clothes, a n d fl oo rs grounded workstat i on equi pm en t and tools esd tabl e/s h e l f ma t ma de o f co ndu c t i v e ma ter i al s pr o p er gr o u nding is r e qu ir ed f o r all d e v i c e s, equ i pm en t, and mac hi ner y used in pr o d uct a s s e mb ly . surge protecti on should be cons idere d wh en de sig n ing of commercia l products. if tools or e q uip m e n t co nt ain i n s u la ti ng mat e ria l s su ch as gla ss or pla s t i c , t h e fol l o wi ng m e as u r es agai n s t el ec t r os t a ti c di sch arge are stron g ly re com m e n ded : diss ipat i n g sta t ic c h arg e wi th co nduc t i ve mat e ria l s preventi ng charg e gen e r a tion w i th m o is ture n e u t r a l i z i n g t h e c h a r g e w i t h i o n i z e r s th e cu st ome r i s advi se d to c h ec k if the leds are da ma ged by esd when performi ng th e c h ar acter i s t i cs in spe c t i on of th e le ds in t h e app l i c at ion. damage ca n be detected with a forw ard v o ltag e mea s u r eme n t or a l i g h t - up te st a t lo w curren t ( 1m a ) . esd damag e d led s may h a ve an incr e a s e d leak ag e cur r ent , cur r e nt f l o w at a lo w vo ltage o r no lo nge r ill umina t e at a lo w cur r e n t . f a ilur e c r iter ia : v f <2.0 v at i f =0.5ma
n i chia st s-da1- 2599c 16 (6) t h ermal manageme nt proper th er mal manage m e nt is a n i m po r t an t when designing prod uc ts with le ds . le d di e t e mp er at ure i s affec t ed by pcb ther mal r e sistan ce and le d spa c ing on th e boar d. pl eas e de sig n produc ts in a w a y that t h e l ed d i e t e mperature does not exceed th e max i mu m j unc t i on t e mper a t ure ( t j ). drive curre nt s h oul d be d e ter m ined for t h e s u rround ing ambi en t te mp er ature (t a ) to dis s ipa t e the h e at from the pr oduct . the fol l owi n g equat i on s ca n be us ed to c a lcu l a t e the ju nct i on te mper a t ure of t h e pro d uct s . 1 ) t j =t a +r ja ? w 2 ) t j =t s +r js ? w * t j =led junc tio n te mp e r ature: c t a = a m b i e nt te mp e r a t ure : c t s =soldering te mper a t ure ( c at hode s i de) : c r ja =th e rm a l resi stance from juncti o n to am b i ent: c/w r js =therm a l resi stance from juncti o n to t s measuring point: c /w w = i n p u t p o w e r ( i f v f ): w ts p oint (7) cl eani ng if r e quir ed, isopr o py l a l coho l (ip a ) s h oul d be use d . ot he r solven ts may caus e pre m at ure fai l ure to t h e le ds due to the d a mage to th e r e si n port ion . t h e effe ct s of s u ch solve n t s s h ould b e ver i f i ed pr ior to u s e . in additio n , the use of c f c s su ch as freo n is hea v ily regula ted . ul tr ason ic cl eani ng i s no t recom m e nded s i nc e i t ma y have adverse eff e ct s on t h e l e ds depending on the ultr ason ic power a n d h o w led is assembled. if ultr asoni c clea ni ng m u s t be use d , t h e c u sto m er is adv ised to mak e sure th e le ds w i ll not b e da ma ged prior to cleaning . (8) ey e saf e t y in 2006, t h e interna t i o nal el ec t r i c a l comm is si on (iec ) publi s hed iec 62471: 200 6 phot obi o l o gic a l s a fet y of l a m p s and lamp sy ste m s, wh ic h a dded le ds in it s scop e . on t h e ot her hand, t h e iec 60825- 1: 20 07 l a s e r s a f e t y s t andard r e mo v e d leds from it s sc ope. howev e r , please b e advised that some co untr i es and regions ha v e ado pted stand a rds bas ed on t h e iec l a s e r safet y s t a n dard iec 60825- 1: 20 112001, whi c h s t ill i n cl udes leds i n i t s sc op e. most of n i chi a's leds ca n be cl a s si fied as bel o ng ing in to either the ex empt group or risk group 1. hi gh - p owe r le ds , t h at em it li gh t con t ai ni ng blu e w a vel e ngth s, ma y be cla s sified as risk group 2. please pro c eed wi th cau t io n whe n view in g direc t ly an y leds driv en at high current, o r vi ewing led s with opt i ca l ins t ru me nt s w h ic h may gr eat l y in crease th e damage s to your eyes . view ing a f l ashing ligh t ma y cause ey e d i scomfort. w h e n in cor p or ati n g the l e d in to your pr oduct , please be careful to a v oid adv erse eff e cts on the hu man body caused by ligh t stimu l a t ion. (9) ot hers the le d s d e scr ibed in th is brochure ar e i n te nded to be used for ordin a ry e l ec t r oni c equ i pm en t ( s uch as offi ce eq uipm ent, commun i cat i ons equ i pm en t, mea s ure m e n t in str um e n t s and hou s eho l d applia nc es ). consult nichia's sales staf f in adv an ce fo r informa t io n on th e applica t ions in wh ich ex ceptiona l qua l it y and r e liab i l i t y ar e r e q u ir ed , par t i cu lar l y when the f a il ur e or malf u n c t ion of the le ds m a y dir e c t ly j e o par dize lif e or h e a l t h ( s u c h a s f o r a i r p la ne s , ae r o s p ac e, s u bm e r si bl e repeaters, nuc l e ar reactor co ntrol system , a u tom o bil e s, tr affic contr o l equi p m en t, l i fe s u pport sy s t e m s and safe ty devic e s ) . the c u s t om er sha ll not reverse eng i ne er by disas s e m bl i n g or analys i s of the le ds wi t h out ha v i ng pr i o r writt e n co ns ent from nich ia . when def e c t ive le ds are fou n d, t h e c u s t om er sha ll inf o r m ni ch ia dir e c t ly bef o r e di sas s e m bl ing or ana l y s is . both th e cu sto m ers a n d n i chia w i ll agr ee on offici al s p ec ifi c at io ns of su pplied produc ts before a custom er 's v o lume production . specificatio ns and app ear a nce subject to chang e for i m provem en t w i tho u t not i c e .
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